无厂半导体模型

As a fabless semiconductor company, we focus our resources and talent on in-house design and research. We outsource the semiconductor manufacturing process to a network of global suppliers, which includes fabrication, assembly and test, and distribution. This model provides us with the flexibility to scale and diversify our manufacturing capacity based on customer requirements and the broader business environment. In selecting our suppliers, we strive to balance factors such as geographic diversification, technological capabilities, and competitive cost.

研发

研发
Cirrus Logic 内部工程设计团队不断探索新半导体架构和材料,以推动集成电路 (IC) 创新。

设计和验证

设计和验证
Our engineers begin IC design in collaboration with our silicon layout designers, converting product specifications into the physical layout of components. This ensures that when the IC is built, it will meet both product specifications and our high-quality standards.

制造

制造
产品设计开始后,我们会选择一家满足特定产品性能、产量和质量标准的工厂。这些先进的工厂使用纯硅晶圆和其他原材料,按照我们的规格生产组件。

组装和测试

组装和测试
Cirrus Logic products then leave the foundry in wafer form and ship directly to our highly specialized vendors for final assembly and test. At this point in the packaging process, wafers are transformed into devices that are capable of interfacing with customer end applications.

封装和分销

封装和分销
We use high-quality, JEDEC-compliant packaging to ensure safe shipment of our products to their destination. Working closely with our global third-party distribution providers, we then deliver products to customers’ production lines.

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联系我们或我们的授权第三方销售代表、服务合作伙伴和我们的分销商,咨询设计问题或询价。

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